Wafer Backside Coating Of Die Attach Adhesives New Method Simplifi es Process, Saves Money
نویسندگان
چکیده
Size. With traditional paste die attach, the adhesive forms a fi llet around the chip. This is a useful visual indicator to confi rm that suffi cient adhesive has been applied. It also increases the die shear strength by supporting the side of the die. However, the fi llet effectively increases the footprint area of the chip, which means that any packaging must be slightly larger than the die itself. This extra area can be quite substantial after adding the tolerances that account for variations in fi llet size due to differences in paste volume, fl ow, and misplacement of paste and die. Since all paste adhesives are prone to resin bleed, space must be left to ensure that surrounding bond pads are not affected by excessive bleed.
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